Metal Coating:Gold
Mode of Production:SMT
Layers:Fr4
Base Material:Fr4
Certification:RoHS,CCC,ISO
Customized:Fr4
Item | PCB Parameters |
Material | FR4 (140Tg, 170Tg, 180Tg), FR-406, FR-408, 370HR, IT180A, Metal Core, etc |
Material Brands | KB, ITEQ, SY, ISOLA, etc |
Layer Count | 1-40 |
Flammaility | UL 94V-0 |
Thermal Conductivity | 0.3W-300W/mk |
Quality Standards | IPC Classes 2/3 |
HDI Build-up | Any Layer, up to 3+N+3 |
Board Thickness | 0.2~7mm |
Min Thickness | 2-layer: 0.2mm 4-layer: 0.4mm 6-layer: 0.6mm 8-layer: 0.8mm 10-layer: 1mm More than 10 layers: 0.5*Layer Count*0.2mm |
Copper Thickness | 0.5-20oz |
Inks | Super White Inks/Solar/Carbon Inks |
Solder Mask Thickness | 0.2mil-1.6mil |
Surface Finishes | Bare Copper, Hasl lead-free, ENIG, ENEPIG, Gold Fingers, OSP, IAg, ISn, etc |
Plating Thickness | HASL: Copper Thickness: 20-35um Tin: 5-20 um Immersion Gold: Nickel: 100u"-200u" Gold: 2u" -4u" Hard Plated Gold: Nickel: 100u"-200u" Gold: 4u"-8u" Golden Finger: Nickel: 100u"-200u" Gold: 5u"-15u" Immersion Silver: 6u"-12u" OSP: Film 8u"-20u" |
Min Hole Size | 0.15mm |
Min Trace Width/Spacing | 2mil/2mil |
Via Plugging | 0.2~0.8mm |
Line Width/Space Tolerance | ±10% |
Board Thickness Tolerance | ±5% |
Hole Diameter Tolerance | ±0.05mm |
Hole Location Tolerance | ±2mil |
Layer to Layer Registration | 2mil |
S/M Registration | 1mil |
Aspect Ratio | 10:01 |
Blind Vias Aspect Ratio | 1:01 |
Outline Tolerance | ±0.1mm |
V- CUT Tolerance | ±10mi |
Bevel Edge | ± 5mil |
Warp and Twist | ≤0.50% (max cap) |
Quality Test | AOI, 100% E-test |
Value-Added Services | DFM Check, Expedited Production |
Featured Processes | Bonding, Impedance Control, Via in Pad, Press Fit Hole, Countersink/Counterbore Hole, Castellated Vias, Edge Plating, Peelable Solder Mask, Resin Plugged, Plating Flat |
Data Formats | Gerber, DXF, PCB doc, ODB++, HPGL, BRD, etc |
Tel:18576671675
E-mail:fred@jhfpcb.com
Address:801,Yongsheng Building Xinhe Avenue , Shajing, Bao'an District, Shenzhen, Guangdong, China