E-mail: fred@jhfpcb.comPhone: 18576671675

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PCB board


Bluetooth Headset PCB Printed Circuits Board PCBA and PCB

Metal Coating:Gold
Mode of Production:SMT
Layers:Multilayer
Base Material:FR-4
Certification:RoHS,CCC,ISO
Customized:Customized

Product Description
Item PCB Parameters
Material FR4 (140Tg, 170Tg, 180Tg), FR-406, FR-408, 370HR, IT180A, Metal Core,  etc
Material Brands KB, ITEQ, SY, ISOLA, etc
Layer Count 1-40
Flammaility UL 94V-0
Thermal Conductivity 0.3W-300W/mk
Quality Standards IPC Classes 2/3
HDI Build-up Any Layer, up to 3+N+3
Board Thickness 0.2~7mm
Min Thickness 2-layer: 0.2mm
4-layer: 0.4mm
6-layer: 0.6mm
8-layer: 0.8mm
10-layer: 1mm
More than 10 layers: 0.5*Layer Count*0.2mm
Copper Thickness 0.5-20oz
Inks Super White Inks/Solar/Carbon Inks
Solder Mask Thickness 0.2mil-1.6mil
Surface Finishes Bare Copper, Hasl lead-free, ENIG, ENEPIG, Gold Fingers, OSP, IAg, ISn, etc
Plating Thickness HASL:
Copper Thickness: 20-35um Tin: 5-20 um
Immersion Gold:
Nickel: 100u"-200u" Gold: 2u" -4u"
Hard Plated Gold:
Nickel: 100u"-200u" Gold: 4u"-8u"
Golden Finger:
Nickel: 100u"-200u" Gold: 5u"-15u"
Immersion Silver: 6u"-12u"
OSP: Film 8u"-20u"
Min Hole Size 0.15mm
Min Trace Width/Spacing 2mil/2mil
Via Plugging 0.2~0.8mm
Line Width/Space Tolerance ±10%
Board Thickness Tolerance ±5%
Hole Diameter Tolerance ±0.05mm
Hole Location Tolerance ±2mil
Layer to Layer Registration 2mil
S/M Registration 1mil
Aspect Ratio 10:01
Blind Vias Aspect Ratio 1:01
Outline Tolerance ±0.1mm
V- CUT Tolerance ±10mi
Bevel Edge ± 5mil
Warp and Twist ≤0.50% (max cap)
Quality Test AOI, 100% E-test
Value-Added Services DFM Check,  Expedited Production
Featured Processes Bonding, Impedance Control, Via in Pad, Press Fit Hole, Countersink/Counterbore Hole, Castellated Vias, Edge Plating, Peelable Solder Mask, Resin Plugged, Plating Flat
Data Formats Gerber, DXF, PCB doc, ODB++, HPGL, BRD, etc

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Tel:18576671675

E-mail:fred@jhfpcb.com

Address:801,Yongsheng Building Xinhe Avenue  , Shajing, Bao'an District, Shenzhen, Guangdong, China

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