Printed Circuit Board Etching and Universal Printed Circuit Board

The process of printing circuit boards from light boards to display circuit patterns is a relatively complex physical and chemical reaction process.At present,the typical process for processing printed circuit boards(PCBs)is to use the"pattern electroplating method".The copper foil needs to be retained on the outer layer of the circuit board,which is the patterned part of the circuit.A lead tin anti-corrosion layer is pre coated,and then the remaining copper foil is chemically corroded,known as etching.
The etching method is a method of removing copper foil from conductive circuits using an etching solution.The carving method is the use of a carving machine to remove copper foil other than conductive circuits.The former is a relatively common chemical method,while the latter is a physical method.
Reduce cutting edges and increase etching coefficient
Horizontal erosion produces sharp edges.Generally speaking,the longer the printed board stays in the etching solution,the more severe the side etching will be.Trimming seriously affects the accuracy of printed wires,and severe trimming can prevent the production of fine wires.When the cutting edge and edge decrease,the etching coefficient increases.A high etching coefficient indicates that thin lines can be maintained and the etching lines are close to the size of the original image.
Whether it is tin lead alloy,tin,tin nickel alloy,or nickel,if the corrosion resistance of the coating is too high,it will cause a short circuit in the wire.Due to the easy breakage of the protruding edges,an electric bridge is formed between the two points of the wire.