PCB multilayer copper-clad board

It is impossible to manufacture any quantity of PCB multilayer boards without encountering some problems,which are mainly related to the material of PCB multi-layer copper clad laminates.When quality issues arise during the actual manufacturing process,the substrate material of PCB multilayer boards often seems to be the cause of the problem.Even a well written and actually implemented PCB multi-layer lamination technical specification does not specify the necessary testing items to determine whether PCB multi-layer lamination is the cause of production process problems.Here are some of the most common PCB multi-layer lamination issues and how to identify them.
Once you encounter issues with PCB multi-layer lamination,you should consider adding it to the PCB multi-layer lamination specification.Under normal circumstances,if this technical requirement is not met,it will lead to continuous changes in product quality and result in product scrapping.
Material problems caused by changes in the quality of multi-layer PCB laminates typically occur in products produced by manufacturers using different batches of raw materials or different compression loads.Few users have sufficient records to distinguish specific pressure loads or material batches at the processing site.Therefore,it is often the case that PCB multilayer boards are continuously produced and installed with components,and constantly produce warping in the solder bath,which wastes a lot of labor and expensive components.
If the batch number of the material can be immediately found,the PCB multi-layer board manufacturer can verify the resin batch number,copper foil batch number,and curing cycle.In other words,if users cannot provide the continuity of the quality control system of PCB multi-layer board manufacturers,it will lead to long-term losses for users themselves.The following introduces the general issues of substrate materials in the manufacturing process of PCB multilayer boards.
2.Surface issues
Symptoms:Poor printing adhesion,poor electroplating adhesion,some parts cannot be etched off,and some parts cannot be welded.
Available inspection methods:Typically used for visual inspection by forming visible waterlines on the surface of the board.
Possible reason:The surface is very dense and smooth due to the release of the film,and the uncoated surface is too bright.Usually,on the uncoated side of the laminate,the laminate manufacturer will not remove the release agent.The pinholes in the copper foil cause resin to flow out and accumulate on the surface of the copper foil.This situation usually occurs on copper foil that is thinner than the 3/4 ounce weight specification.Copper foil manufacturers apply excessive amounts of antioxidants to the surface of copper foil.Laminate manufacturers have changed their resin systems,stripping or spraying methods.
Due to improper operation,there are many fingerprints or oil stains.When performing stamping,cutting,or drilling operations,lubricating oil should be used.
Possible solution:It is recommended that laminated panel manufacturers use thin films or other demolding materials similar to fabrics.Contact the laminate manufacturer and use mechanical or chemical elimination methods.For each batch of unqualified copper foil,please contact the laminated product manufacturer for inspection;Explore recommended methods for resin removal.Inquire with the laminated panel manufacturer about the disassembly method.Changing suggests using hydrochloric acid and then mechanically scrubbing to remove it.Before making any changes to the production of laminated panels,you should collaborate with the laminated panel manufacturer and clarify the user's testing items.
Education staff wear gloves and hold copper-clad laminates throughout all processes.Check if the laminated material is equipped with suitable gaskets or bags,the gaskets have low sulfur content,and there is no dirt in the packaging bags.When using cleaning agents containing silicon copper foil,ensure that no one comes into contact with it and degrease all laminates before electroplating or pattern transfer processes.