Issues to pay attention to when casting copper for PCB boards

The so-called copper tilt refers to using unused space on a PCB as a reference surface and then filling it with solid copper.These copper containing areas are also known as copper filled areas.The significance of copper plating is to reduce the impedance of the ground wire and improve its anti-interference ability;Reduced voltage drop,improved power supply efficiency,and reduced loop area through connection to ground wire.As is well known,at high frequencies,the distributed capacitance of wiring on printed circuit boards will play a role.When the length is greater than 1/20 of the wavelength corresponding to the noise frequency,antenna effect will be generated and noise will be emitted through wiring.If there is a poorly grounded copper cladding in the PCB of a circuit board factory,the copper cladding will become a noise transmission tool.Therefore,in high-frequency circuits,do not assume that the grounding wire is grounded.This is the"ground wire",which must be less thanλ/20 in order to make a hole in the"good grounding"connection with the grounding plane of the multi-layer circuit board.If handled properly,copper plating not only increases current but also plays a dual role in shielding interference.
When pouring copper,in order to achieve the expected effect,the following issues need to be noted when pouring copper:
If there are many grounding points on the PCB board,such as SGND,AGND,etc.,based on the position of the PCB board,use the main"grounding"as a reference and independently pour copper.Digital grounding and analog grounding will not be too many,and copper cannot be poured separately.At the same time,before pouring copper,thicken the corresponding power wiring:5.0V,3.3V,etc.,to form multiple deformable structures with different shapes.
2.For single point connections with different grounds,the method is to connect them through a 0 ohm resistor,magnetic bead,or inductor.
As shown in Figure 3.The metal inside the equipment,such as metal radiators and metal reinforcement strips,must be well grounded.
As shown in Figure 4.The problem with an island(dead zone)is that if you think it's too big,it won't cost too much to determine a venue to pass through and add it.
5.Do not pour copper into the middle layer of the opening of a multi-layer circuit board.Because it is difficult for you to ensure a good grounding of the copper on this PCB board.
6.Copper falls near the crystal oscillator.The crystal oscillator in the circuit is a high-frequency emission source.The method is to pour copper around the crystal oscillator and then ground the crystal oscillators separately.
At the beginning of wiring,the grounding wire should be treated in the same way.When wiring,the wiring should be good.The connection after copper plating cannot rely on adding through holes to eliminate grounding pins.This effect is very poor.
It is best not to have sharp corners(<=180 degrees)on the PCB board,as from an electromagnetic perspective,this constitutes a transmitting antenna!It always has an impact on others,but the impact is significant or minimal.I suggest using curved edges.
The heat dissipation metal block of the three end regulator must be well grounded.The grounding isolation band near the crystal oscillator must be well grounded.In short,if the copper grounding problem on the PCB is solved,then the benefits outweigh the drawbacks.It can reduce the return area of the signal line and reduce the electromagnetic interference of the signal to the outside world.
In short,for copper on PCBs,if you want to deal with grounding issues,the benefits must outweigh the drawbacks.It can reduce the return area of signal lines and reduce electromagnetic interference of signals.