Structure:Multilayer FPC
Material:Polyester Film
Combination Mode:Without Adhesive Flexible Plate
Application:Digital Products,Computer with LCD Screen,Mobile Phone,Aviation and Aerospace
Conductive Adhesive:Conductive Silver Paste
Flame Retardant Properties:V0
Layers | 1-16 layers |
Copper Thickness | 0.5-6 OZ |
Material | FR-4Copper, FPC , Ceramic, Aluminum-based, High Frequency, Thick Copper Board, Gold, Rogers, Taconic, Argon, Nalco, Isola, High TG. |
Solder Mask | White.Black.Yellow.Green.Red.Blue |
Finished Surface | conventional hasl, lead free hasl, immersion gold, immersion tin,immersion silver, hard gold, OSP... |
Min Solder Mask Bridge | 0.08mm |
Plugging Vias capability | 0.2-0.8mm |
Minimum Annlar Ring | 4mil |
Max Copper thickness | UL certificated: 6.0 OZ |
Minimum line width/gap | 3.5/4mil(laser drill) |
Minimum hole size | 0.15mm (mechanical drill) /4mil(laser drill) |
Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control |
Products Type | High-Frequency board, impendance controlled board, HDI board, BGA & Fine pitch board |
Tel：18576671675
E-mail：fred@jhfpcb.com
Address：801,Yongsheng Building Xinhe Avenue , Shajing, Bao'an District, Shenzhen, Guangdong, China
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